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Technology

 Micro-technology Division Electronic Devices Division
Going Beyond Conventional Limits Electronics for a New Generation
Micro-technology Division Electronic Devices Division
Micro-Hole Metal Stamping COB
Micro-Parts Metal Stamping TCP/COF
Precision Forging Flip-chip
Thin Sheet Metal Stamping Ball Assembly
Ultra-precision processing technology capable of realizing sub-micron level accuracy of form.From electromechanical components and composite parts for precision and information equipment, through to the precision metal stamping of non-metal materials, Misuzu Industries can meet demand with its integrated development system, starting from mold design and construction. Starting with information and multimedia equipment, we can respond to the increasing miniaturization and performance of the rapidly growing microelectronics field. From circuit board design to assembly, we provide high precision semiconductor circuit modules such as COB, TCP, COF, BGA and MCM, with our advanced development and production system.
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